Microwave Remote Sensing of Snowpack Properties.

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[文献类型]:科技报告
[标题]:Microwave Remote Sensing of Snowpack Properties.
[作者]:rango, a.
[机构]:National Aeronautics and Space Administration,Greenbelt,MD. Goddard Space Flight Center.
[关键词]:conferences,hydrology,microwave radiometers,remote sensing,snow cover,brightness temperature,microwave emission,moisture content,
[出版年份]:1980
[报告号]:NASA-CP-2153
[报告时间]:1980,
[页码]:272p
[馆藏索取号]:N8119511
[总页数]:8


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[文献类型]:科技报告
[标题]:Solar-Geophysical Data Number 569,January 1992. Part 2 (Comprehensive Reports). Data for July 1991and Miscellaneous.
[作者]:coffey, h. e.
[机构]:National Geophysical Data Center,Boulder,CO.
[关键词]:solar activity,solar flares,solar radio bursts,solar x rays,solar prominences,stellar mass ejection,goes 7,tables(data),ntiscomnoa
[出版年份]:1992
[报告号]:SGD-569-PT-2
[报告时间]:Jan 92,
[页码]:107p
[馆藏索取号]:PB92158898
[总页数]:0


[唯一标识符]:10.1117/12.918312
[文献来源]:国际光学工程学会数据库
[文献类型]:科技会议
[标题]:Block copolymer directed self-assembly enables sublithographic patterning for device fabrication
[作者]:He Yi;Xin-Yu Bao;Li-Wen Chang;
[文摘]:The use of block copolymer self-assembly for device fabrication in the semiconductor industryhas been envisioned for over a decade. Early works by the groups of Hawker, Russell, and Nealey[1-2] have shown a high degree of dimensional control of the self-assembled features over largeareas with high degree of ordering. The exquisite dimensional control at nanometer-scale featuresizes is one of the most attractive properties of block copolymer self-assembly. At the same time,device and circuit fabrication for the semiconductor industry requires accurate placement of desiredfeatures at irregular positions on the chip. The need to coax the self-assembled features into circuitlayout friendly location is a roadblock for introducing self-assembly into semiconductormanufacturing. Directed self-assembly (DSA) and the use of topography to direct the self-assembly(graphoepitaxy) have shown great promise in solving the placement problem [3-4]. In this paper, wereview recent progress in using block copolymer directed self-assembly for patterning sub-20 nmcontact holes for practical circuits.
[卷]:8323
[会议名称]:Alternative Lithographic Technologies IV
[会议时间]:20120329
[总页数]:7